SICK Sensor Intelligence BMH10-0311 Bus Connection Module

BMH10-0311 Bus Connection Module by SICK Sensor Intelligence is a compact DeviceNet interface that bridges a SICK CLV optical sensor to a DeviceNet network. It provides the bus connection via terminal strips and mounts on a standard DIN rail (top-hat rail) alongside other SICK modules, simplifying wiring and integration in automation lines. The unit operates from 10 to 30 V DC and typically consumes about 3 W, making it suitable for 24 V automation environments. Designed for a CLV sensor, it translates the CLV’s sensing outputs onto the DeviceNet bus, enabling real-time status and diagnostic information to be read by a PLC or networked controller. This module is part of SICK’s BMH/BMV family of bus connection modules and is described in official SICK operating instructions as the DeviceNet variant used to connect a CLV to DeviceNet networks. Typical applications include manufacturing automation where a SICK CLV photoelectric sensor monitors parts on a conveyor and communicates presence/absence data to a centralized controller, improving line visibility and control without wiring every sensor device individually.