{"product_id":"disco-corporation-zhzz-sd2000-h1-110-a1783-b22-diamond-dicing-blades","title":"DISCO Corporation ZHZZ-SD2000-H1-110-A1783 B22 Diamond Dicing Blades","description":"\u003cdiv\u003e\u003cp\u003eThe DISCO Corporation ZHZZ-SD2000-H1-110-A1783 B22 Diamond Dicing Blade is a precision blade designed for dicing silicon wafers in semiconductor manufacturing. It carries the part number ZHZZ-SD2000-H1-110-A1783 B22 and is specified for silicon wafer applications. This blade supports wafer fabrication processes that require silicon wafer cuts.\u003c\/p\u003e\u003c\/div\u003e","brand":"Disco","offers":[{"title":"New","offer_id":46293252505834,"sku":null,"price":73.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8039\/3450\/files\/GTG-STOCK-065.png?v=1788727428","url":"https:\/\/gtghardware.com\/products\/disco-corporation-zhzz-sd2000-h1-110-a1783-b22-diamond-dicing-blades","provider":"GTG Hardware","version":"1.0","type":"link"}