{"product_id":"disco-corporation-zh05-sd2000-n1-130-a1434-bb-diamond-dicing-blade","title":"DISCO Corporation ZH05-SD2000-N1-130-A1434-BB Diamond Dicing Blade","description":"\u003cdiv\u003eDISCO Corporation ZH05-SD2000-N1-130-A1434-BB is a silicon wafer diamond dicing blade designed for precise cutting of silicon substrates. Built for wafer-dicing operations, this blade uses diamond abrasive to deliver clean, controlled cuts during semiconductor fabrication. The part number identifies this specific blade model within DISCO’s family of wafer-dicing blades, clarifying its role in the silicon wafer processing workflow.\u003c\/div\u003e","brand":"Disco","offers":[{"title":"New","offer_id":46293252473066,"sku":null,"price":581.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0716\/8039\/3450\/files\/GTG-STOCK-065.png?v=1788727428","url":"https:\/\/gtghardware.com\/products\/disco-corporation-zh05-sd2000-n1-130-a1434-bb-diamond-dicing-blade","provider":"GTG Hardware","version":"1.0","type":"link"}